Mercury Receives $6.7M BuiltSECURE Memory Order for Airborne Computing Application

Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $6.7 million follow-on order from a leading defense prime contractor for BuiltSECURE™ high-density secure memory devices to be integrated into the command, control and intelligence system of an advanced airborne platform. The order was booked in the Company’s fiscal 2019 first quarter and is expected to be shipped over the next several quarters.

The Company’s BuiltSECURE technology transforms a two-dimensional array of discrete memory devices into a single, vertically-integrated memory module offering enhanced ruggedization for extreme operating environments. With space savings up to 85% enabled by this innovation, system architects can integrate larger memory capacities to support processing-intensive applications while simultaneously reducing the overall footprint of the system.  BuiltSECURE memory devices are designed and manufactured in the Company’s Phoenix, Ariz. Advanced Microelectronics Center (AMC).

“Our Advanced Microelectronics Center is honored to receive this follow-on order for space-saving, high-speed memory devices designed to withstand the harshest operating environments encountered by our warfighters,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Receiving this order further reaffirms Mercury’s leadership position in the design and manufacturing of state-of-the-art, SWaP-optimized digital microelectronics in a safe, secure and trusted environment.”