Mercury Systems, Inc. announced it received a $7.7 million follow-on order from a leading defense prime contractor for BuiltSecure™ high-density secure memory devices integrated into a state-of-the-art airborne command, control and intelligence system. The order was booked in the Company’s fiscal 2018 second quarter and is expected to be shipped over the next several quarters.
BuiltSecure memory devices leverage the Company’s expertise in three-dimensional packaging technology, transforming a two-dimensional array of memory devices into a single, vertically-integrated memory module ruggedized for the harshest military operating environments. With up to 85% space savings enabled by Mercury’s BuiltSecure memory devices, valuable board real estate is now available to system architects for the incorporation of additional components needed to support enhanced system functionality. BuiltSecure memory devices are designed and manufactured in the Company’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz.
“We are very pleased to receive this follow-on order from our valued customer for BuiltSecure high-speed memory devices,” said Charlie Leader, Senior Vice President and General Manager of Mercury’s Advanced Microelectronics Solutions group. “With the capabilities embedded in our Phoenix AMC, Mercury delivers the most advanced commercial memory technologies in a compact form factor engineered to withstand the harshest operating conditions encountered by our warfighters.”
Source: Mercury Systems
Date: Jan 11, 2018