Mercury Receives $3.8M Microelectronics Order for Airborne EW Application

Mercury Systems, Inc. announced it received a follow-on $3.8 million order from a leading defense prime contractor for multi-chip module devices integrated into an advanced airborne electronic warfare system. The order was booked in the Company’s fiscal 2018 second quarter and is expected to be shipped over the next several quarters.

Mercury’s broad portfolio of secure digital microelectronic solutions are designed and manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA)-trusted Advanced Microelectronics Center in Phoenix, Ariz. The Company’s state-of-the-art three-dimensional packaging technology delivers maximum space-savings in a highly ruggedized ball grid array (BGA) package designed for harsh military environments.

“We are honored to continue supplying trusted microelectronics enabling our military forces’ most advanced airborne platforms to dominate the electromagnetic spectrum,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronic Secure Solutions group. “Defense prime contractors and our military forces can count on Mercury’s next-generation business model for long-term supply continuity of the most affordable, compact and high-performance microelectronics solutions.”

Source: Mercury Systems
Date: Nov 23, 2017