Army Geospatial Mapping Program Contract
Leidos (NYSE: LDOS) will support the Army Geospatial Center's (AGC) High-Resolution, 3-D (HR3D) Geospatial Information program through a prime contract from the General Services Administration (GSA). The single-award task order awarded under the GSA One Acquisition Solution for Integrated Services (OASIS) contract has a one-year base period of performance and includes four one-year options. If all options are exercised, the contract carries a total value of $777 million.
Under the contract, the Leidos team will collect, process, disseminate, store and maintain HR3D geospatial information. Leidos will conduct airborne and terrestrial collection operations, process the information and produce geospatial products needed over operationally relevant areas. In the collection process, Leidos will also integrate advanced Light Detection and Ranging (LIDAR) sensor technology from a higher altitude using a higher velocity aircraft platform. KEYW Corporation, Tenax TM LLC., Neany Inc., Sigma Space Corp., OG Systems LLC., Pixia Corp. and Woolpert Inc. are teaming with Leidos to provide the cost-effective solutions and capabilities for the AGC program.
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Insufficient unclassified HR3D geospatial information also limits the ability of the U.S. to adequately engage other nations in expanding their capabilities and working towards a sustainable, secure environment. The AGC program will address this critical gap for high-resolution mapping products covering the majority of the undeveloped world.
"Leidos has a long history of directly supporting U.S. Army warfighters through vital airborne programs," said Roger A. Krone, Leidos' Chairman and Chief Executive Officer. "Our team is excited to continue that support using advanced technologies to produce critical mapping products."
"The selection of the Leidos team on this contract solidifies our standing as leaders in airborne capabilities," said John Fratamico, president of the Leidos Advanced Solutions Group. "We remain dedicated to supporting our customer and providing cost-effective, advanced technology solutions to meet the DoD's mission requirements."
Source : Leidos - view original press release
Mar 29 - 30, 2017 - London, United Kingdom
Jan 1 - Dec 31, 2017 - USB Drive, Windows Computer