Comtech Telecommunications Corp. (Nasdaq:CMTL) announced today that its Santa Clara, California-based subsidiary, Comtech Xicom Technology Inc., received an order for $3.4 million for Solid-State Power Amplifiers (SSPAs) to be used in an airborne, In-Flight Connectivity application. This order is a follow-on production award in this growing commercial airborne market.
“Connectivity is fundamental to modern life. New technologies continue to drive the communications landscape and passengers are demanding improved connectivity while flying,” said Dr. Stanton Sloane, President and Chief Executive Officer of Comtech Telecommunications Corp. “Comtech has developed industry-leading airborne amplifier technology to deliver superior high-speed communication services to the traveling public.”
Source: Comtech Telecommunications Corp.
Date: Jan 7, 2016